Notable posts and threads related to

Infineon and InterDigital share a ten year partnership for the development of chips for 3G
           #8 of FIFTEEN CATALYSTS for future InterDigital REVENUE

Updated January 24, 2005

Fifteen revenue catalysts have the potential to produce dramatic upswings in the earnings of WirelessLedger's current focus stock, InterDigital Communications Corp. (IDCC). Some of the most informative posts and threads are culled from the most useful investment message board on the Internet (it is hosted by Investors Hub).

For a listing and links to some of the the best posts in all fifteen catalysts, click here.

What these "best posts" on the Infineon Partnership below are about:

If these chips prove to be popular with wireless device manufacturers, the profits could be substantial. Posts here generally deal with apparent successes or failures in developing and marketing this new Infineon-InterDigital chip technology.

See also: Links to "best posts" on these related revenue catalysts:

#6 How will new technologies affect InterDigital?

InterDigital's patented air interface technology is essential to all current standards for 3G, ensuring royalties for the rest of this decade. But there are many proposals for enhancing current 3G (e.g. TDD, WiFi, WLAN, HSDPA, steerable antennas), or even replacing existing 3G standards for some applications. And some day there will be a 4G. Although a relatively small firm, InterDigital sits at many standards-setting tables and is deeply involved in developing patented technology for a variety of 3G enhancements. As new technologies jockey for positions, which of them strengthen and which could weaken InterDigital's long term position in the industry? Posts here describe progress on these technology developments and often comment of their potential impact on InterDigital.

Also see these other related WirelessLedger reports:
Understanding Intellectual Property
30 Year Evolution of InterDigital's Business Model
An Introduction to Wireless Telecommunications for Non-Techie Investors

Catalyst #8 POSTS and THREADS (from I Hub)
(generally most recent posts are first)

  Editor's note: The Investors Hub Message Board on InterDigital offers hundreds of helpful new posts every day on everything related to IDCC. Visit it daily! If you don’t have time to read all the fine posts there, you can catch some of the highlights here by way of these “best posts.” But there are ten or twenty times more posts worth reading at iHub than can be reproduced here.

Posted by: imalurker_2
In reply to: Eneerg who wrote msg# 91726 Date: 1/19/2005 11:06:38 AM
Post # 91730

I would have thought the Infineon announcement would be second only to the Arbitration results.
By the end of the day, it may be First.

Posted by: Eneerg
In reply to: my3sons87 who wrote msg# 91725 Date: 1/19/2005 10:50:29 AM
Post # 91726

RE:
Loop, thanks. I just wanted to be sure that the fire is still under the tea kettle, even if it is just on simmer.

sons... no I-HUB feedback on this IFX feature article I'm aware of...

http://neasia.nikkeibp.com.hk/neasia/000020

S-GOLD

Infineon introduces Complete UMTS Handset Platform Solution.
Development Time and Costs Savings for 3G Handsets of up to 50 Percent

France February 18, 2003 - Infineon Technologies (FSE/NYSE: IFX) an-nounced today a complete UMTS handset solution at the 3GSM World Congress in Cannes. This solution facilitates the transition from today?s GSM mobile phones to multimode 3G handsets. It supports 384 kbps data transfer as well as high-speed data transfer via EDGE, which many operators are considering as part of the evolu-tion to 3G. The FP1-Ux called platform is the result of a joint development with US based companies Zyray Wireless and InterDigital Communications Corporation, in conjunction with Infineon wholly owned subsidiaries Comneon and Danish Wireless Design.

Mobile phone manufacturers thus have early access to a complete 3G system solu-tion dramatically shortening time-to-market of their 3G handsets. The time and cost advantage is significant and is realized by combining an Infineon S-Gold® based 2.5G platform running a multimode protocol stack with the SPINNER® WCDMA baseband processor made by Zyray Wireless.

Karl Lange, Vice President and General Manager of Customized Solutions at In-fineon Technologies, said: ?The single flexible solution enables manufacturers to cre-ate multiple devices ranging from mass market 3G phones to fully featured multime-dia appliances. With the first working handset system solution already demonstrated in Cannes, Infineon Technologies is well prepared for the 3G market and offers a cost-optimized solution at the right time.?

The system solution also comprises a multimode protocol stack that was jointly de-veloped by Comneon - and InterDigital Corporation. This protocol stack provides a complete handset software solution for rapid product deployment. Infineon?s radio frequency chips from the SMARTi® family, the APOXI application framework and a reference man-machine interface round up the complete 3G solution. Danish Wire-less Design has also completed a multi-mode, form factor reference design for use by handset manufacturers.

About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solu-tions for the automotive and industrial sectors, for applications in the wired communi-cations markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2002 (ending Septem-ber), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is avail-able at www.infineon.com.

SPINNER is a registered trademark of Zyray Wireless.

This news release is available at http://www.infineon.com/news

http://www.dwd.dk/newsind.htm

Posted by: loophole73
In reply to: my3sons87 who wrote msg# 91715 Date: 1/19/2005 10:34:28 AM
Post # 91722

RE:
I was just wondering when the IFX chip agreement is going to begin to bear some fruit.

My3

When the COO is the chief presenter at investment conferences, it makes it difficult to focus on chip and antenna production. IDCC admonished the shareholders long ago that they (IFX) would not be first to market in the chip race. Many of the terminals being offered today have come from the first line of production at the various manufacturers. Many of the terminals have just started public usage and the results with respect to flaws or necessary slight improvements have yet to be ratified via consistent data. Late 2005 and 2006 will be the years of initiation if IFX so chooses.

MO
loop


Posted by: Eneerg
In reply to: None      Date:1/4/2005 10:55:40 AM
Post # 89103

Infineon Focuses on Basic Phones, 3G, Multimedia

News from Asia-Pacific

by Keith Chan

(January 2005 Issue, Nikkei Electronics Asia)

"Asia is our largest growing market, and no other region can create so many new mobile phone users," said Erk Thorsten Heyen, CEO, Secure Mobile Solutions Business Group, Infineon Technologies AG.

In the last fiscal year ended September 30, 2004, Heyen's division?-- which covers handsets, security chips and wireless infrastructure -- recorded a 28% increase in revenues. It also gained market share and improved its profitability from -5% to 7%.

Heyen said since the last few years, Infineon has adopted a new business model for its handset manufacturing customers in Asia. Instead of simply selling the chips, the company now provides complete hardware and software solutions so as to enable its customers to get their products to the market quicker.

To capitalize on further growth potential from the region, Heyen's division is concentrating its efforts on three areas: basic phones; UMTS (universal mobile telecommunications system), and multimedia.

Basic phones are mobile phones with basic functions targeted at less developed markets, generally with a retail price of under US$150. Heyen said despite the name, basic phones tend to have more and more functions in order to be sold on the market.

For Infineon, the challenge is to create semiconductors with higher integration so that handset manufacturers can reduce their costs by using fewer components.

"Over the last two years, while we have increased the functions of our mobile phones, we have reduced component content by a factor or two, and reduced the cost of mobile phones by 35%," he said.

3G Phones from Chip Maker

In the area of UMTS, Heyen said China's Huawei Technologies has recently announced a UMTS handset which is based on Infineon's complete reference design and application software. He said this project is especially significant for Infineon because it demonstrates that Infineon is one of the few semiconductor companies in the world to have all the IPs necessary for a 3G mobile phone. Until recently, Heyen added, all of the world's 3G solutions were designed by large phone manufacturers such as Nokia, Sony-Ericsson and Motorola, etc.

In multimedia, the challenge for the company is to integrate more and more multimedia applications into the mobile phones. Heyen said over the past few years the company has integrated many cellular and multimedia functions into its single-chip baseband processors to help handset manufacturers to reduce their costs.

For instance, the company's next-generation baseband processor, called the S-Gold2, with a clock speed of 200MHz, can support a 2-Mpixel camera and handle a wealth of multimedia applications without separate application processors.

"If you categorize the whole mobile phone market segment, say, from 0% to 100%, this chip can cover 40% to 95% of the market, with the exception of high-end, PDA-type phones," said Heyen.

http://neasia.nikkeibp.com/nea/200501/cohk_351639.html

----------------------------
Yet Another 3G Handset Solution (Infineon * InterDigital * Zyray)

some concrete news regarding IDCC - and it isn't Nokia or Ericsson

Infineon Announces 3G Handset Solution Package

Infineon Technologies has launched a complete UMTS handset solution, which supports 384 kbps data transfer as well as high-speed data transfer via EDGE, which many operators are considering as part of the evolution to 3G. The FP1-Ux called platform is the result of a joint development with US based companies Zyray Wireless and InterDigital Communications Corporation, in conjunction with Infineon wholly owned subsidiaries Comneon and Danish Wireless Design.

Mobile phone manufacturers thus have early access to a complete 3G system solution dramatically shortening time-to-market of their 3G handsets. The time and cost advantage is significant and is realized by combining an Infineon S-Gold based 2.5G platform running a multimode protocol stack with the SPINNER WCDMA baseband processor made by Zyray Wireless.

Karl Lange, Vice President and General Manager of Customized Solutions at Infineon Technologies, said: "The single flexible solution enables manufacturers to create multiple devices ranging from mass market 3G phones to fully featured multimedia appliances. With the first working handset system solution already demonstrated in Cannes, Infineon Technologies is well prepared for the 3G market and offers a cost-optimized solution at the right time."

The system solution also comprises a multimode protocol stack that was jointly developed by Comneon -- and InterDigital Corporation. This protocol stack provides a complete handset software solution for rapid product deployment. Infineon's radio frequency chips from the SMARTi family, the APOXI application framework and a reference man-machine interface round up the complete 3G solution. Danish Wireless Design has also completed a multi-mode, form factor reference design for use by handset manufacturers.

http://www.siliconinvestor.com/readmsg.aspx?msgid=18611250

Posted by: Data_Rox
In reply to: my3sons87 who wrote msg# 88062
Date:12/28/2004 10:00:18 AM
Post # 88064

RE:
Data, thanks for the info. It still sounds good. Or as they say on MTV and the like, "its all good".

it's all good times 2...I agree!

Posted by: TFWG
In reply to: Data_Rox who wrote msg# 88038
Date: 12/28/2004 8:26:19 AM
Post # 88041

RE:
It's still alive...
"This is the one containing IDCC protocol stack, right?
Please say it is so.

Yes, the Comneon protocol stack for 2g/2.5g/3g is still the one that includes our work....and to date only works with one version of the Zyray/Broadcom bolt-on FDD processor with customers that are using the Infineon 2G (S-GOLD) baseband - creating the dual baseband solution. "

Woohooooo!

Posted by: Data_Rox
In reply to: 3GDollars who wrote msg# 87999
Date:12/28/2004 8:02:37 AM
Post # 88038

3G$

RE:

This is the one containing IDCC protocol stack, right?

Please say it is so.

Yes, the Comneon protocol stack for 2g/2.5g/3g is still the one that includes our work....and to date only works with one version of the Zyray/Broadcom bolt-on FDD processor with customers that are using the Infineon 2G (S-GOLD) baseband - creating the dual baseband solution.

Here is the diagram of the Comneon stack - our work is over on the right side (UMTS Layer 1 and UMTS Access Stratum).

http://www.comneon.com/CDA/view_diagram,116,0,,en.html

[WL ed note: Comneon is a wholly owned subsidiary of Infineon. The chip with IDCC layers will be marketed as a Comneon product]

Posted by: mschere
In reply to: None
Date:12/27/2004 3:18:15 PM
Post # 87996

COMNEON
UMTS/W-CDMA
Multimode Software Solution
Comneon’s proven track record in provisioning robust protocol stacks and intimate knowledge of UMTS specifications enables us to offer the best 3G software in the market.

The UMTS Protocol Stack Software

Based on more than 12 years of experience in GSM protocol software, Comneon is now offering a complete 3GPP UMTS multimode protocol stack supporting 3GPP Release 99 UMTS/GSM/E-GPRS standards.

The solution allows users to benefit from the high-bandwidth of UMTS in metropolitan areas and to seamlessly switch over to legacy GSM, GPRS, or EDGE services in areas not yet covered by UMTS.

Based on Comneon’s Mobile Software Platform, our highly integrated, cost-effective UMTS protocol stack is fully compatible with Comneon’s APOXITM Application Framework to enable popular applications such as MMS, video streaming, MP3, and many more.

A fully Compliant and Robust 3G Solution

Comneon has combined its 2.5G software with a best-in-class UMTS solution in order to provide a comprehensive, easily configurable 3G platform. The key modules are:

Non Access Stratum
UMTS Access Stratum
GSM/E-GPRS Access Stratum
UMTS FDD Layer 1
GSM/GPRS Layer 1
Select multimode software features:

Complete Type I and Type II multimode UE software, in accordance with 3GPP 21.910.
Small code size FDD single-mode variant available.
Compliant with 3GPP Release 99 March 2003.
Supporting InterRAT Handover and Cell Reselection.
UMTS Class A support (3GPP 22.060).
Compressed Mode support.
Supports SIM/USIM.
FDD PS / CS, configurable for data classes up to 384Kbit/sec (uplink & downlink).
Supports IPv4.
Conforms to ETSI UICC Specifications.
Supports GSM and E-GPRS supporting up to class 12.
Common Development Framework/System Architecture across multimode solution.
Emphasis on Quality: The UMTS Test Strategy

To ensure best-of-class software quality, advanced methods of module, integration, and system test activities are performed throughout the various development phases.

Host simulation environments facilitate realistic software simulation of the UTRA interface to rigorously test the UMTS Access Stratum and Non Access Stratum components of the stack. For target testing, dedicated test equipment for Layer 1 specific testing as well as integration and conformance testing of Layers 1, 2 and 3 are utilized.

During the compliance testing phase, comprehensive test suites are used consisting of verified 3GPP conformance tests as well as proprietary test cases implemented in TTCN and C++.

Combined with our rigorous internal testing program, Comneon’s experienced IOT team is working closely with key industry players to ensure interoperability and a robust UMTS system when operating in a multi-vendor network environment.

Through continuous testing with the major UMTS infrastructure providers, Comneon can provide a proven solution to its handset and data card customers and enable them to smoothly ramp up their 3G products in 2004 and 2005.

The Comneon UMTS Solution: Key Advantages

Our complete 3G multimode solution provides a range of advantages, including:

Software designed with portability selects one of the main design criteria.
Abstraction layers provided for both hardware and Operating System independency.
Common design methodology between UMTS and GSM/E-GPRS to enable smoother upgrades and maximize performance.
Optimal use of OS resources & common memory to achieve a memory-efficient solution.
Rapid Integration of new applications and reuse of existing applications with APOXITM Application Framework.
Close tracking of standards development that provides for fast access to the latest features.
Customer Benefits: Comneon’s Value Added

Our world-class support allows customers maximum flexibility in development of dual-mode or single-mode terminals. Key benefits include:

A scalable product and project methodology translating into a limited and predictable investment in R&D.
Customers retain control of all project phases and mitigate risks, with strong quality & cost control.
Excellent support in customizing Comneon‘s UMTS platform and facilitating the reuse of software technology across the customer’s range of future phones.
Continuous enhancement of the UMTS/W-CDMA product roadmap through advanced applications and protocol software.
A strong model of co-working with customers that has been repeatedly validated for bringing quality phones into the market on target.

Posted by: mschere
In reply to: None
Date:12/9/2004 4:15:53 PM
Post # 86646

Infineon Introduces Industry`s Smallest Eight-Channel T1/E1/J1 Framer and Line Interface Chip for Channeling Increased Voice and Multimedia Traffic
2004-12-09

Munich, Germany – December 9, 2004 – Infineon Technologies AG (FSE/NYSE: IFX), the world’s leading supplier of ICs for T/E carrier grade telecom systems, today introduced OctalFALC™, the industry’s smallest FALC® (Framer and Line Interface Unit Component) offering eight ports per chip. The latest member of Infineon’s FALC product family doubles the density per chip used in universal line cards and reduces the bill of material by around 15 percent. OctalFALC addresses the growing global voice and multimedia traffic over fixed and mobile telephone networks; in 2003 worldwide voice traffic alone amounted to nearly 200 billion minutes. On average, three in every four of the world’s 19 million cellular base-stations that are used to transport wireless voice and data communication are equipped with ICs from Infineon.

OctalFALC is the industry’s first eight channel, single-chip component that uses arbitrary input clocks and integrates analog switches, resulting in reduced circuit board complexity and bill of material. With eight ports on a footprint of 289 square millimeters, OctalFALC offers twice as many channels in almost the same space as previous generations. It supports all three Primary Rate standards T1/E1/J1 and is ideally suited for applications such as 2G/3G Wireless Base Stations, DSLAM (DSL Access Multiplexers), Digital Access Cross-Connect and DLC (Digital Loop Carrier) systems.

A recent report issued by the market research firm Gartner Dataquest expects an annual growth rate in the deployment of T1/E1 ports of 10 percent per year worldwide, mainly driven by advanced services offered over 3G cellular networks - such as short text messages, images, and even video.

“Designers of T1/E1 line cards have four main criteria when selecting components: time to market, small size, low power and specification compliance. The Infineon OctalFALC meets all of these criteria, with software compatibility to recent FALC versions, state-of-the-art packaging and process technology,” said Christian Wolff, Vice President of the Wireline Communications Business Group and General Manager of the Access Business Unit at Infineon Technologies.

T/E carrier systems carry the bulk of telecommunication voice and data traffic in both wireless and wireline core networks. As the number of cellular and fixed-line telephone connections and multimedia traffic continues to increase, service providers need to expand their networks either by incorporating additional T/E systems or by upgrading existing infrastructure. By using OctalFALC-enabled line cards, service providers can double the network’s port density without placing additional equipment in the field and reduce labor costs while achieving faster time to market.

About OctalFALC™
OctalFALC offers eight ports per chip, currently the maximum for multi-channel solutions, with the industry’s smallest footprint of 17mmx17mm. The ability to operate from any available clock source ranging from 1.02 to 20MHz and the possibility of being software switched between T1/E1 and J1 operations allows for the design of a single interface to all three of the worldwide Primary Rate standards. It is operated with separate 3.3V and 1.8V supplies and meets the short-haul and long-haul requirements of T1/E1 and J1. Operating temperature ranges between -40°C and +85°C.

Pricing and Availability
Samples of the OctalFALC in a Plastic Low Ball Grid Array (PG-LBGA-256) package with a 1.0mm ball pitch are available now at US-Dollar 35 for high volumes. The OctalFALC is supported by the EASY22558 Evaluation kit with a Configuration Wizard CD-ROM containing a PC-based graphical user interface and device driver code as well as a complete set of documentation. For further information please visit www.infineon.com/falc.

About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2004 (ending September), the company achieved sales of Euro 7.19 billion with about 35,600 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.

Information Number: INFCOM200412.020

mschere